Nov. 7, 2025 – GIGABYTE TECHNOLOGY Co. Ltd, the world’s leading computer brand, takes extreme performance and style to the next level with its All New X870E AORUS XTREME X3D AI TOP motherboard. First unveiled at GIGABYTE EVENT 2025, the X870E AORUS XTREME X3D AI TOP is the world’s first Flagship motherboard platform purpose-built for AMD Ryzen™ X3D processors, delivering GIGABYTE X3D Turbo Mode 2.0 for uncompromising gaming and productivity, industry-leading DDR5 speeds of up to 9000+ MT/s, and a smarter user experience through innovative thermal solutions (e.g., CPU Thermal Matrix etc.), Unrivaled EZ-DIY features, and DriverBIOS technology.
At the core of the X870E AORUS XTREME X3D AI TOP is X3D Turbo Mode 2.0, a dynamic AI overclocking model trained on big data, tailored for per-chip optimization and resulting in a custom tuning profile with optimal results. This breakthrough enables users to achieve the optimal balance without compromise, improving 25% gaming performance and 14% multi-tasking productivity over default settings. By intelligently finetuning frequency, power, and thermal behavior, X3D Turbo Mode 2.0 unleashes the true potential of AMD Ryzen™ X3D processors.
Premium power, Top-tier design
X870E AORUS XTREME X3D AI TOP supports AMD Ryzen™ 9000/ 8000/ 7000 processors with a high-performance architecture designed for enthusiasts. Equipped with a robust 24+2+2 (SPS 110A) VRM design drive the Ryzen™9 9950X3D with ease, delivering full performance without compromise.
Flagship-Grade Exclusive Cooling Design
The power and thermal design has been meticulously crafted, utilizing top-tier materials and featuring exclusive CPU Thermal Matrix to evenly distribute heat. This innovative design significantly lowers temperatures in the DDR and VRM areas. The DDR Wind Blade XTREME, with its newly evolved streamlined airflow design, further enhances overall cooling efficiency. In addition, the M.2 Thermal Guard XTREME, combined with a 5mm built-in fan and heat fins, delivers an exceptional cooling experience for high-performance SSDs. Finally, the large Fins Array heatsinks, dual 8+6 mm heat pipes, and oversized bottom heatsink ensure optimal performance and stability for gamers.
D5 Bionic Corsa: Redefining Memory Overclocking
AI-powered D5 Bionic Corsa pushes DDR5 to 9000+ MT/s. Forget trial-and-error; one click gives you fast, stable overclocking with zero effort.
EZ-DIY Friendly Design and Comprehensive Connectivity
The new DriverBIOS function offers seamless wireless connectivity right out of the box – no need to install Wi-Fi driver additionally, it’s integrated in the BIOS. Furthermore, it features an expanded 64MB BIOS capacity, doubling the previous size to support more complex firmware and future updates.
Build faster and easier than ever with tool-free installation across other fantastic EZ-DIY features including M.2 EZ-Match, M.2 EZ-Flex, PCIe EZ-Latch Plus Duo, WI-FI EZ-Plug, M.2 EZ-Latch Click, M.2 EZ-Latch Plus, and the EZ-Debug Zone. With the X870E AORUS XTREME X3D AI TOP, PC building becomes smoother, cleaner, and frustration-free.
X870E AORUS XTREME X3D AI TOP features full-bandwidth PCIe Gen5 x16 slots for latest Gen5 graphics cards and Gen5 M.2 SSD connections across multiple form factors, ensuring compatibility with a wide range of system configurations. Advanced wireless connectivity options include Dual 10G LAN & Wi-Fi 7(320MHz), coupled with GIGABYTE’s innovative directional high-gain antenna with ARGB lighting.
And as a special encore, our redesigned flagship delivers an unboxing experience packed with fun surprises waiting to be discovered. Let’s salute the pinnacle of excellence together!
For more info please refer to:
X870E AORUS XTREME X3D AI TOP : https://www.gigabyte.com/Motherboard/X870E-AORUS-XTREME-X3D-AI-TOP
