USB 3.2 spec announced with double the speed for existing Type-C SuperSpeed cables
BEAVERTON-The USB 3.0 Promoter Group today announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices. USB…
Journey to 5G: Singtel launches near-gigabit mobile data speeds at selected high-traffic outdoor locations
Offers Southeast Asia’s fastest Gigabit-class LTE mobile speeds at 800Mbps Singapore, July 2017 – Singtel is launching in phases, near-gigabit speeds on its LTE-Advanced network at selected high-traffic outdoor locations…
Microsoft Announcing the new Surface Pro for Singapore
Pre-orders for the most versatile laptop on the planet start today at the Microsoft Store, authorised retailers and commercial resellers SINGAPORE, JULY 2017 — Microsoft, today, announced that the new Surface Pro…
Bluetooth SIG Announces Mesh Networking Capability
Brings proven, global interoperability and the mature, trusted ecosystem of Bluetooth technology to industrial-grade device networks Bluetooth SIG Announces Mesh Networking Capability Kirkland, Washington – July 18, 2017 – The Bluetooth Special…
Samsung Increases Production of Industry’s Fastest DRAM ─ 8GB HBM2, to Address Rapidly Growing Market Demand
With 256GB/s memory bandwidth, Samsung’s 8GB HBM2 offers the highest DRAM performance for the most data-intensive, high-performance applications Samsung Electronics, the world leader in advanced memory technology, today announced…
BenQ announces ZOWIE XL 2546 PC e-Sports Monitor with DyAc
Taipei, Taiwan, July 2017 – BenQ announces the ZOWIE XL2546 monitor with Dynamic Accuracy (DyAcTM), providing PC gamers with another option to suit personal preference. Since its release in Dec.…
Intel Unveils Powerful Intel Xeon Scalable Processors, Bringing Next-Generation Business and Consumer Experiences to Life
Intel Data Center Platform Offers Industry’s Highest Levels of Perform, Biggest Data Center Advancement in a Decade HIGHLIGHTS Intel® Xeon® Scalable processors are uniquely architected for today’s evolving data center…
Toshiba Memory Corporation Develops World’s First 3D Flash Memory with TSV Technology
Achieves high speed data input and output, low power consumption, large capacity TOKYO—Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world's first BiCS FLASH™ three-dimensional…
ASRock To Offer H110 Pro BTC+ Mining Motherboard for 13 GPUs
TAIPEI, Taiwan, July 2017 – Being one of the most experienced crypto mining motherboard manufacture, ASRock has always been the top choice for miners, to extend this superior tradition, we're…
Cooler Master Launches the COSMOS II 25th Anniversary Edition
Dual curved tempered glass side panel Stylish and streamlined race-car inspired look Product Link: http://www.coolermaster.com/case/full-tower/cosmos-2-25th-anniversary-edition/ SINGAPORE – Cooler Master, a leader in design and manufacturing computer components and peripherals,…
