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Einfoldtech > News > MSI IPC Launches MS-CF16 V3.0 Pico-ITX SBC with Intel® Alder Lake-N/Amston Lake/Twin Lake Series for Rugged Applications
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MSI IPC Launches MS-CF16 V3.0 Pico-ITX SBC with Intel® Alder Lake-N/Amston Lake/Twin Lake Series for Rugged Applications

Husky
Last updated: 07/11/2025 8:53 AM
Husky
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4 Min Read
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MSI IPC, a leading provider of industrial embedded solutions, is proud to introduce its latest compact computing platform, the MS-CF16 V3.0 Pico-ITX single board computer. Engineered for fanless operation and low power consumption while maintaining high computing performance, this new board is purpose built for deployment in extreme environments and industrial use cases such as factory automation, smart kiosks, transportation systems, and edge devices.

 

Contents
      • Key Features
  • Industrial Grade Durability and Versatility
Built around the latest Intel® Alder Lake N, Amston Lake, and Twin Lake processors, the MS-CF16 V3.0 delivers next generation computing in a small form factor, making it perfect for edge computing, industrial automation, smart retail, and embedded IoT applications.
  • Intel® Alder Lake-N/ Amston Lake/Twin Lake Series SoC
  • LPDDR5 4800 MHz onboard memory up to 16GB
  • Dual independent displays: HDMI, LVDS/eDP
  • 1 2.5 GbE/1 GbE LAN with RJ-45
  • 2 USB 3.2 (Bottom layer USB 3.2 Gen 2 x 1, Top layer USB 3.2 Gen 1), 2 USB 2.0, 2 COM (RS-232/422/485), GPIO, Audio
  • 1 M.2 B Key, 1 M.2 E Key Slot
  • SATA 3.0 for storage
  • Wide operating temperature : -40~70°C
  • DC-IN 12V

 

Key Features

  • High Performance Memory
    The onboard LPDDR5 memory runs at 4800 MHz and is available in configurations up to 16 GB. This high bandwidth memory enhances system responsiveness while maintaining low power usage.
  • Dual Display Output
    It supports 2 independent displays. It offers 1 HDMI port for high-definition external monitors and 1 LVDS or embedded DisplayPort option for integration into panel systems. This flexibility supports a wide range of user interface and visualization needs.
  • Advanced Networking
    It includes 1x 2.5 GbE port and 1x GbE port, both with RJ 45 connectors. These highspeed network interfaces ensure reliable data transmission for industrial automation and real time communication.
  • Comprehensive I O Expansion
    It offers a rich set of input and output interfaces including:
    1. 2 USB 3.2 ports
    2. 2 USB 2.0 ports for legacy device support
    3. 2 COM ports configurable for RS-232, RS-422, or RS-485
    4. 16Bit General purpose input output interface
    5. Audio interface for multimedia or voice integration
    6. Flexible Expansion Slots
      Equipped with 1 M.2 B Key slot for storage or cellular modules and 1 M.2 E Key slot for WiFi or Bluetooth connectivity, it supports a variety of expansion options tailored to specific application needs.
    7. Storage Support
      1 SATA 3.0 interface is available for connection to solid state drives or hard drives, enabling reliable local data storage.
    8. Wide Operating Temperature
      Designed for deployment in harsh environments, the board operates reliably in temperatures ranging from minus 40°C to 70°C, making it ideal for outdoor, vehicle mounted, or industrial cabinet use.
    9. Efficient Power Design
      It requires a 12V direct current input, offering compatibility with standard industrial power sources and simplifying system integration.

 

Industrial Grade Durability and Versatility

With its compact size, wide temperature tolerance, and rich feature set, the MS-CF16 V3.0 is designed to meet the diverse needs of embedded system developers, industrial OEMs, and system integrators. Whether used in smart manufacturing, medical equipment, digital signage, or transportation infrastructure, this board delivers performance, stability, and expandability in a small form factor.

 

With its robust design and versatile connectivity options, the MS-CF16 V3.0 is tailored for mission critical deployments in challenging environments. This new board reinforces MSI IPC’s commitment to delivering cutting edge industrial computing solutions for the evolving embedded market.
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