Direct Touch Heatpipes, Stack Fins, Superior Fan Design, Succeed under Prime 95 250 Watts with ease
Taipei, Taiwan, August 3rd, 2020 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards graphics cards, and hardware solutions, today announced AORUS ATC800 tower fan which is specially designed for multi-core processors, features stack fins, 6 Direct Touch Heatpipes that are each 6mm in diameter, as well as a dual ball bearing structure, dual fan, and a unique fan blade design. It delivers superior heat dissipation TDP suppression for overclocking the Intel® Core™ i9-10900K CPUs to all cores at 5.1GHz under a Prime 95 burning-in test. AORUS ATC800 also integrates smart CPU temp/RPM light indicators for users to easily manage the system dissipation condition.
“Our liquid cooling products with i9 10900K CPU have accomplished all-core at 5.2GHz under the burn-in test, which is attractive to many users. However, there are also comparatively more constraints on liquid cooling to make users hesitate” stated Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “GIGABYTE AORUS ATC800 tower fan makes use of fin thermal pad, 6 Direct-Touch Heatpipes, each 6mm in diameter, dual ball bearing structure, and our unique fan blade design, for superior heat dissipation. All of these features are not only designed for users to overclock their Intel® Core™ i9-10900K CPUs to all cores at 5.1GHz under the Prime 95 burn-in test, but definitely fulfills all kinds of needs for CPU heat dissipation. The easy display of the temperature function and fashionable appearance are also essential to why people are enthusiastic for AORUS.”
With the help of its composite mounting bracket, AORUS ATC800 can fully support most of the Intel and AMD processors, so users can upgrade to the latest 10th Generation Intel® Core™ processors without extra purchase of new fans. AORUS ATC800 implements stack fins to enlarge the dissipation area. With 6 Direct-Touch Copper Heatpipes, each 6mm in diameter, it can increase 20% in surface area compared to other designs of 3 heatpipes, which bolster heat dissipation. Specialized welding between the heatpipes and stacked fins not only strengthens the structure of the design but also draws heat away more quickly from the CPU to the fins, allowing the dual ball bearing fan to significantly lower temperatures.
Enhanced with distinguished product design, AORUS ATC800 can easily mitigate the heat and over 250 Watts TDP which is generated from overclocking the Intel® Core™ i9-10900Ks to all cores at 5.1GHz under the Prime 95 burn-in test. It not only provides users an excellent overclocking experience, but also reveals the design strength and quality of GIGABYTE AORUS cooling products.
Aside from being able to dissipate heat effectively, AORUS ATC800 embeds fashionable lighting effects that serve as a prompt key indicator for CPU temperature and fan RPM. Users don’t need to access software or the BIOS to easily manage thermal conditions and build their cool and effective systems.
